The e-ILV provides free access to all the terms and definitions contained in the international standard CIE S 017:2020 ILV: International Lighting Vocabulary, 2nd edition.

To search for another term please use  "Back to the list" to return to the main page or the e-ILV.

For the complete set of terms and definitions CIE S 017:2020 can be purchased from the CIE Webshop. Members of a CIE National Committee or Associate National Committee have access to a 66,7 % discount on the purchase price of the standard.

For advice on CIE Publications contact Note the CIE Helpdesk cannot assist with technical enquiries.


LED die

separated part of a wafer intended to perform as an LED in a device

Note 1 to entry: A device can be an LED package.

[SOURCE: IEC 60050-521:2002, 521-05-30, modified – Term qualified by "LED", synonym "chip" omitted, "(or whole)" omitted and "a function or functions" replaced by "as LED" in the definition, and Note 1 to entry added.]

Publication date: 2020-12
Copyright © CIE 2020. All Rights Reserverd.