cie

17-27-051

LED die

separated part of a wafer intended to perform as an LED in a device

Note 1 to entry: A device can be an LED package.

[SOURCE: IEC 60050-521:2002, 521-05-30, modified – Term qualified by "LED", synonym "chip" omitted, "(or whole)" omitted and "a function or functions" replaced by "as LED" in the definition, and Note 1 to entry added.]

Publication date: 2020-12
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